Semiconductor Device and Process Integration Masterclass

Semiconductor Device and Process Integration Masterclass gives you an in-depth understanding of semiconductor device physics and how individual fabrication processes are integrated to produce working, reliable devices. As devices continue to shrink and become more complex, engineers need to understand how each process step affects device performance and yield. This masterclass is designed for process, device, integration, yield and equipment engineers, technicians and technical professionals working in or entering the semiconductor industry.

You will start with the fundamentals of device physics and device fabrication, covering semiconductor materials, energy bands, doping, carriers, p-n junctions and the operation of MOSFETs and other key devices. You will then review the major fabrication steps, including oxidation, lithography, etching, deposition, ion implantation, diffusion, chemical mechanical planarisation and metallisation, and how they combine to build front-end and back-end structures.

The second topic focuses on process integration issues, examining how process interactions affect threshold voltage, leakage, reliability and yield, and exploring challenges such as short-channel effects, isolation, contact and interconnect resistance, and defect control. You will analyse real integration problems and discuss approaches to solving them. By the end of the masterclass, you will understand the link between device physics and fabrication, and be better able to diagnose integration issues and contribute to improving device performance and yield.