Course Details
Course Details
What You'll Learn
Topic 1 CMOS Process Modules and Process Flow
CMOS process modules
Photolithography and Mask
Etch
Clean
Ion Implantation
Diffusion and RTP
Film
CMP
CMOS process flows
Topic 2 Semiconductor Device Phyics
PN Junction
MOS Capacitor
MOSFET
BJT
Memory Devices
Topic 3: CMOS Process Integration and Performance
CMOS process integration and sort yield
CMOS device and reliability performances
Statistical process control
Overview of future IC technologies – Chiplet, FINFET and GAAFET
Topic 3: Packaging
Wire Bonding
Flip Chip and Surface Mount Technologies
3D Stacking and Through Silicon Via (TSV) Packaing
Topic 4: Future Trend in IC Technlogies
Chiplet Technology
FINFET and GAAFET
Silicon Photonics
Non-Silicon Technologies
Course Info
Prerequisite
This is a intermediate level course. The following prerequisite is assumed
Software Requirement
Please download and install the following software prior to the class
- Python 3.x https://www.python.org/downloads/
- Sublime Text 3 https://www.sublimetext.com/3
- Pycharm https://www.jetbrains.com/pycharm/download/
Job Roles
Job Roles
- Semiconductor Process Engineer
- CMOS Integration Engineer
- Semiconductor Device Physicist
- Process Development Engineer
- Packaging Engineer
- Photolithography Engineer
- Wafer Fabrication Specialist
- Etching Process Engineer
- Semiconductor Yield Engineer
- Reliability Engineer
- Process Control Engineer
- Test Engineer
- Ion Implantation Engineer
- CMP Process Engineer
- Semiconductor Packaging Engineer
- IC Design Engineer
- Flip Chip Packaging Specialist
- 3D Packaging Engineer
- Chiplet Integration Engineer
- Semiconductor Research Scientist